If the mask is running 5c hotter than the last mask exposure, how much hotter should the silicon wafer be than the last time it was exposed so that everything lines up as perfectly as possible? the error budget is 19 nm, the 1x reticle and chip size is 39 mm, and the thermal expansion coefficient for the silica mask and silicon wafer are 5*10^-7 and 2.6*10^-6 respectively.

answer: - 3.) the oxidation state of nitrogen in no changes from +2 to 0, and the oxidation state of carbon in co changes from +2 to +4 as the reaction proceeds.

solution: - as per the rules, oxidation number of oxygen in its compounds is -2. the sum of oxidation numbers of all the elements of a molecule or compound is zero.

also, the oxidation number in elemental form is zero.

in no, the oxidation number of o is -2 so the oxidation number of n is +2 so that the sum is zero.

similarly, the oxidation number of c in co is +2 and o is -2.

on product side the oxidation number of n is 0 as it is in the elemental form() .

oxidation number of c in carbon dioxide is +4 as there are two oxygen in it and we know that each oxygen is -2.

so, oxidation number of n is changing from +2 to 0 and the oxidation number of c is changing from +2 to +4.

since nitrogen is reduced and hence no is acting as an oxidizing agent. carbon is oxidized and so co is acting as a reducing agent.

so, the right choice is number 3.)the oxidation state of nitrogen in no changes from +2 to 0, and the oxidation state of carbon in co changes from +2 to +4 as the reaction proceeds.

it's all four options.