The yield of good chips in multiprobe for a certain batch of wafers is 75%. the wafers have a diameter of 300 mm with a processable area that is 280 mm in diameter. if the defects are all assumed to be point defects, determine the density of point defects using the bose-einstein method of estimating yield.

Afoot bridge is made as a simple deck, 4 m long, with a cross section 2 m (wide) and 20 cm thick, and made of wood. the deck is supported at the two ends. the maximum load allowable on the bridge is 10 tons, provided it is uniformly distributed on the deck. to sense this load, a strain gauge is placed at the center of the bridge and its resistance is monitored. if the sensor has a nominal resistance of 350 s2 and a gauge factor of 3.6, what is the reading of the strain gauge at maximum load? the modulus of elasticity for the wood used in the construction is 10 gpa.