(a) use the gauss-seidel method to solve the following system until the percent relative error falls below εs = 5%: [ 0.8 −0.4 − 0 .4 0.8 −0 .4 −0.4 0.8 ] { x1 x2 x3 } = { 41 25 105 } (b) repeat (a) but use overrelaxation with λ = 1.2.

If the thermal strain developed in polyimide film during deposition is given as 0.0044. assume room temperature is kept at 17.3 c, and thermal coefficient of expansion for the film and the substrate are 54 x 10^-6c^-1 and 3.3 x 10^-6c^-1respectively. calculate the deposition temperature.

On a average work day more than work place firs are reorted

Draw the engineering stress-strain curve for (a) bcc; (b) fcc metals and mark important points.