Assume that one component with 256 i/os is offered in three forms: qfp, full array pbga, and fl ip chip with gold bumps. the pitch of the qfp is 0.4 mm and the lead length is 1 mm. an edge of the qfp to the center of the nearest lead is assumed to the same as the lead pitch. the pitch of the bga is 1.27mm and an edge to the center of the nearest solder joints is 2.5 mm. the pitch of the flip chip is 0.4 mm and an edge to the center of the nearest solder joints is1mm. assume the underll extension is 1 mm.
1. calculate the pcb surface area requirement for each case.

Aloaded platform of total mass 500 kg is supported by a dashpot and by a set of springs of effective stiffness 72 kn/m. it is observed that when the platform is depressed through a distance x = 12.5 cm below its equilibrium position and then released without any initial velocity; it reaches its equilibrium position in the shortest possible time without overshoot. find the position and velocity of the loaded platform 0.10 sec. after its release. if a further load of 400 kg is added to the platform, find, i) the frequency of damped vibrations, and i) the amplitude of vibration after 2 complete oscillations, given that the initial amplitude is 15 cm.

Give heat transfer applications for the following, (i) gas turbines (propulsion) ) gas turbines (power generation). (iii) steam turbines. (iv) combined heat and power (chp). (v) automotive engines

Draw the engineering stress-strain curve for (a) bcc; (b) fcc metals and mark important points.