subject
Engineering, 10.04.2020 02:52 macylen3900

Consider a finite wing with an aspect ratio of 7; the airfoil section of the wing is a symmetric airfoil with an infinite-span lift slope of 0.11 per degree. The lift-drag ratio for this wing is 29 when the lift coefficient is equal to 0.35. If the angle of attack remains the same and the aspect ratio is simply increased to 10 by adding extensions to the span of the wing, what is the new value of the lift-drag ratio? Assume that the span efficiency factors e = 0.9 for both cases.

ansver
Answers: 2

Another question on Engineering

question
Engineering, 03.07.2019 14:10
Amass of m 1.5 kg of steam is contained in a closed rigid container. initially the pressure and temperature of the steam are: p 1.5 mpa and t 240°c (superheated state), respectively. then the temperature drops to t2= 100°c as the result of heat transfer to the surroundings. determine: a) quality of the steam at the end of the process, b) heat transfer with the surroundings. for: p1.5 mpa and t 240°c: enthalpy of superheated vapour is 2900 kj/kg, specific volume of superheated vapour is 0. 1483 m/kg, while for t 100°c: enthalpy of saturated liquid water is 419kj/kg, specific volume of saturated liquid water is 0.001043m/kg, enthalpy of saturated vapour is 2676 kj/kg, specific volume of saturated vapour is 1.672 m/kg and pressure is 0.1 mpa.
Answers: 3
question
Engineering, 04.07.2019 03:10
What precautions should you take to prevent injuries when dealing with heavy loads?
Answers: 1
question
Engineering, 04.07.2019 19:10
Which of the following is the most important advantage of a large field of view? a. allows larger areas to be examined b. relieves eyestrain c. minimizes parallax errors. d. increases precision in proportion to the in- crease in field of view
Answers: 2
question
Engineering, 06.07.2019 02:30
1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction
Answers: 1
You know the right answer?
Consider a finite wing with an aspect ratio of 7; the airfoil section of the wing is a symmetric air...
Questions
question
Mathematics, 18.09.2019 19:20
Questions on the website: 13722359