Air is compressed by a 30-kW compressor from P1 to P2. The air temperature is maintained constant at 25°C during this process as a result of heat transfer to the surrounding medium at 20°C. Determine the rate of entropy change of the air.

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction