Assume that one component with 256 I/Os is offered in three forms: QFP, full array PBGA, and flip chip with gold bumps. The pitch of the QFP is 0.4mm and the lead length is 1 mm. An edge of the QFP to the center of the nearest lead is assumed to the same as the lead pitch. The pitch of the BGA is 1.27mm and an edge to the center of the nearest solder joints is 2.5mm. The pitch of the flip chip is 0.1 mm and an edge to the center of the nearest solder joints is 0.2 mm. Assume the underfill extension is 0.2 mm. Calculate the PCB surface area requirement for each case