Engineering, 22.08.2021 18:20 20jhutchinson
38. Evaluate f (3x +4y)dx + (2x --3y)dy where C, a circle of radius two with center at the origin of the xy C plane, is traversed in the positive sense.
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Engineering, 04.07.2019 18:10
Draw the engineering stress-strain curve for (a) bcc; (b) fcc metals and mark important points.
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Engineering, 04.07.2019 18:10
The higher the astm grain size number, the finer the gran is. a)-true b)-false
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Engineering, 04.07.2019 18:10
Which from the following instrument is commonly used to detect the high pitch butzing sound in bearings? [clo4] a)-digital ultrasonic meter b)-infrared camera c)-spectroscopic d)-vibrometer
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1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction
Answers: 1
38. Evaluate f (3x +4y)dx + (2x --3y)dy where C, a circle of radius two with center at the origin of...
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